Mechanical Reliability Of Porous Low-k Dielectrics For Advanced Interconnect: Study Of The Instability Mechanisms In Porous Low-k Dielectrics And Their Mediation Through Inert Plasma Induced Re-polymerization Of The Backbone Structure
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Mechanical Reliability Of Porous Low-k Dielectrics For Advanced Interconnect: Study Of The Instability Mechanisms In Porous Low-k Dielectrics And Their Mediation Through Inert Plasma Induced Re-polymerization Of The Backbone Structure